On November 14, the 7th China Digital Power Key Components Innovation Summit (East China) came to a successful conclusion at the Hilton Suzhou. As one of the most influential annual events in the digital power industry, this year's summit focused on major industry tracks including AI server power supplies, 800V fast charging, SiC/GaN devices, energy storage, and BMS technologies.
700 industry professionalsover 500 companies, fostering in-depth technical exchange and collaboration across the full power electronics ecosystem.
, addressing the challenges of high power density, thermal reliability, and insulation performance in AI-era electronics.
Solutions for High-Power Electronics
We offer several innovative solutions for high-density power:
Replacing traditional "TIM + ceramic/insulation film" stack structures to achieve improved thermal efficiency, enhanced dielectric strength, and lower manufacturing costs.
Providing high-reliability protection against moisture, salt fog, contaminants, and condensation-key risks in data center environments.
Supporting high-frequency and high-flux magnetic components with excellent structural stability and heat resistance.
Improving the reliability of chip packaging under mechanical, thermal, chemical and other stresses, especially in high-power-density scenarios.
Designed for high-power modules requiring high thermal dissipation efficiency, mechanical reinforcement, and improved system durability.
MCOTI is dedicated to advancing high-performance adhesive and innovative solutions that enable safer, more efficient, and more reliable next-generation power systems. Through continued participation in industry platforms such as the Digital Power Innovation Summit, MCOTI will continue advancing high-performance adhesive technologies to support the next generation of AI power systems and high-reliability electronics.
